XC7Z007S-2CLG225I System On Chip (SoC) with 766MHz ARM® Cortex®-A9 MPCore™ and 23K Logic Cells for High Performance Embedded Applications
Category:
Integrated Circuits ICs
Specifications
Base Product Number:
XC7Z007
Peripherals:
DMA
Primary Attributes:
Artix™-7 FPGA, 23K Logic Cells
Series:
Zynq®-7000
Supplier Device Package:
225-CSPBGA (13x13)
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
-40°C ~ 100°C (TJ)
Architecture:
MCU, FPGA
Package / Case:
225-LFBGA, CSPBGA
Number Of I/O:
54
RAM Size:
256KB
Speed:
766MHz
Core Processor:
Single ARM® Cortex®-A9 MPCore™ With CoreSight™
Flash Size:
-
Logic Cells:
23K
Highlight:
766MHz System On Chip (SoC)
,23K Logic Cells Integrated Circuit (IC)
,ARM® Cortex®-A9 MPCore™ Zynq®-7000
Introduction
XC7Z007S-2CLG225I System on Chip
The XC7Z007S is a high-performance System on Chip (SoC) that integrates an ARM® Cortex®-A9 MPCore™ processor with Xilinx's Artix™-7 FPGA fabric. This powerful combination offers unparalleled flexibility and processing power for a wide range of embedded applications.
Key Features
- Integrated ARM® Cortex®-A9 Processor with CoreSight™
- Artix™-7 FPGA Fabric for Customization
- Powerful System on Chip (SoC) Architecture
- 23K Logic Cells for Design Flexibility
- 766MHz Clock Speed for High Performance
Target Applications
Ideal for industrial automation, automotive systems, medical devices, aerospace, and high-performance embedded computing where a combination of processing power and hardware acceleration is required.
Product Attributes
Brand
AMD
Packaging & Delivery
LCL, AIR, FCL, Express
Technical Specifications
| Category | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) |
|---|---|
| Base Product Number | XC7Z007 |
| Product Status | Active |
| Series | Zynq®-7000 |
| Package | Tray |
| Manufacturer | AMD |
| Supplier Device Package | 225-CSPBGA (13x13) |
| Core Processor | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Primary Attributes | Artix™-7 FPGA, 23K Logic Cells |
| Speed | 766MHz |
| Number of I/O | 54 |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Package / Case | 225-LFBGA, CSPBGA |
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