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SmartFusion®2 SoC FPGA with 60K Logic Modules ARM Cortex-M3 Processor in 325-FCBGA Package

Category:
Integrated Circuits ICs
Specifications
Logic Modules:
60K
Clock Speed:
166MHz
Package Size:
325-FCBGA (11x11)
Operating Temperature:
-40°C ~ 100°C (TJ)
Number Of I/O:
200
RAM Size:
64KB
Flash Size:
256KB
Core Processor:
ARM® Cortex®-M3
Peripherals:
DDR, PCIe, SERDES
Connectivity:
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture:
MCU, FPGA
Package Type:
325-TFBGA, FCBGA
Series:
SmartFusion®2
Supplier Package:
325-FCBGA (11x11)
Product Status:
Active
Highlight:

60K Logic Modules SmartFusion®2 SoC

,

ARM Cortex-M3 FPGA SoC

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325-FCBGA System On Chip

Introduction
M2S060-1FCSG325I
SmartFusion®2 FPGA - ARM® Cortex®-M3 SoC
M2S060 60K Logic Modules, 166MHz, 325-FCBGA (11x11)
SmartFusion®2 SoC component view SmartFusion®2 SoC package details SmartFusion®2 SoC application diagram
Product Overview
The Microchip Technology SmartFusion®2 is a high-performance System-on-Chip (SoC) integrating an ARM® Cortex®-M3 processor with a powerful FPGA fabric. This advanced device offers unparalleled flexibility and efficiency for complex embedded applications.
Engineered for demanding industrial, communications, and defense markets, the SmartFusion®2 family provides a complete solution with integrated peripherals, robust security features, and low power consumption, enabling rapid development and deployment of sophisticated systems.
Key Benefits
  • Integrated ARM® Cortex®-M3 processor and FPGA fabric for maximum flexibility
  • High-performance 166MHz clock speed for demanding computations
  • 60K Logic Modules provide ample resources for complex designs
  • Rich peripheral set including DDR, PCIe, and SERDES for extensive connectivity
  • Compact 325-FCBGA (11x11) package for space-constrained applications
Target Industries & Applications
  • Industrial Automation
  • Medical Devices
  • Aerospace & Defense
  • Communications Infrastructure
  • Motor Control
  • Embedded Vision
Product Attributes
Brand Microchip Technology
Origin USA
Material Silicon
Color N/A
Packaging/Delivery LCL, AIR, FCL, Express
FOB Price 0
MOQ N/A
FOB Unit piece
Technical Specifications
Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Base Product Number M2S060
Product Status Active
Peripherals DDR, PCIe, SERDES
Series SmartFusion®2
Package Tray
Manufacturer Microchip Technology
Supplier Device Package 325-FCBGA (11x11)
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 325-TFBGA, FCBGA
Number Of I/O 200
RAM Size 64KB
Speed 166MHz
Core Processor ARM® Cortex®-M3
Flash Size 256KB
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