Home > Products > Integrated Circuits ICs > Zynq UltraScale+ RFSoC FPGA SoC with 930K+ Logic Cells, Quad ARM Cortex-A53, and 1156-FCBGA Package

Zynq UltraScale+ RFSoC FPGA SoC with 930K+ Logic Cells, Quad ARM Cortex-A53, and 1156-FCBGA Package

Category:
Integrated Circuits ICs
Specifications
Logic Cells:
930K+
Peripherals:
DMA, WDT
Package Type:
1156-FCBGA (35x35)
Operating Temperature:
-40°C ~ 100°C (TJ)
Architecture:
MCU, FPGA
Number Of I/O:
366
RAM Size:
256KB
Speed:
533MHz, 1.333GHz
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5 With CoreSight™
Flash Size:
-
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package Case:
1156-BBGA, FCBGA
Series:
Zynq® UltraScale+™ RFSoC
Product Status:
Active
Primary Attributes:
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Highlight:

930K+ Logic Cells Zynq UltraScale+ RFSoC

,

Quad ARM Cortex-A53 FPGA SoC

,

1156-FCBGA Package System On Chip

Introduction
XCZU47DR-2FSVE1156I RFSoC FPGA
Product Overview
Experience unparalleled performance and flexibility with our advanced RF System-on-Chip (SoC) FPGA. Designed for demanding applications, this integrated circuit combines a powerful FPGA fabric with a high-performance ARM processor, enabling complex signal processing and control tasks with exceptional efficiency.
Key Features
  • High Performance Processing
  • Versatile FPGA Fabric
  • Integrated ARM Cores
  • Advanced Signal Processing Capabilities
Target Applications
Aerospace & Defense Wireless Communications Test & Measurement High-Performance Computing
Product Attributes
Brand
AMD
Origin
Unknown
Package
Tray
Color
N/A
Packaging & Delivery
L/C, D/A, D/P, T/T, Western Union, LCL, AIR, FCL, Express
Technical Specifications
Category Integrated Circuits (ICs), Embedded, System On Chip (SoC)
Product Status Active
Peripherals DMA, WDT
Primary Attributes Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Series Zynq® UltraScale+™ RFSoC
Supplier Device Package 1156-FCBGA (35x35)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Manufacturer AMD
Package / Case 1156-BBGA, FCBGA
Number Of I/O 366
RAM Size 256KB
Speed 533MHz, 1.333GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5 With CoreSight™
Flash Size -
Architecture MCU, FPGA
Send RFQ
Stock:
MOQ: