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SmartFusion®2 FPGA System On Chip (SoC) with 90K Logic Modules, 166MHz ARM® Cortex®-M3 in 325-FCBGA Package

Category:
Integrated Circuits ICs
Specifications
Logic Modules:
90K
Core Processor:
ARM® Cortex®-M3
Operating Temperature:
-40°C ~ 100°C (TJ)
Speed:
166MHz
RAM Size:
64KB
Flash Size:
512KB
Number Of I/O:
180
Package Type:
325-FCBGA (11x13.5)
Case Type:
325-TFBGA, FCBGA
Peripherals:
DDR, PCIe, SERDES
Connectivity:
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture:
MCU, FPGA
Base Product Number:
M2S090
Series:
SmartFusion®2
Product Status:
Active
Highlight:

90K Logic Modules SmartFusion®2 FPGA

,

166MHz ARM® Cortex®-M3 System On Chip (SoC)

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325-FCBGA Package Integrated Circuit (IC)

Introduction
M2S090TS-1FCSG325I
Product Overview
Experience the power and flexibility of the ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA. This advanced device offers 90K Logic Modules and operates at 166MHz, housed in a compact 325-FCBGA (11x13.5) package.
Key Features
  • High Performance: 166MHz ARM® Cortex®-M3 core for demanding applications
  • FPGA Flexibility: 90K Logic Modules for custom hardware acceleration and design
  • Rich Connectivity: Extensive peripherals including PCIe, SERDES, CANbus, Ethernet, and USB
  • Wide Operating Range: Reliable performance from -40°C to 100°C
Product Attributes
Brand
Microchip Technology
Origin
Not Specified
Packaging
Tray
Color
Not Applicable
Delivery Options
LCL, AIR, FCL, Express
MOQ
Not Specified
FOB Price (Unit)
0
FOB Unit
piece
Technical Specifications
Category Integrated Circuits (ICs) » Embedded » System On Chip (SoC)
Base Product Number M2S090
Product Status Active
Series SmartFusion®2
Core Processor ARM® Cortex®-M3
Architecture MCU, FPGA
Speed 166MHz
RAM Size 64KB
Flash Size 512KB
Number Of I/O 180
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Supplier Device Package 325-FCBGA (11x13.5)
Package / Case 325-TFBGA, FCBGA
Operating Temperature -40°C ~ 100°C (TJ)
Primary Attributes FPGA - 90K Logic Modules
Ideal Applications: Telecommunications, industrial automation, medical devices, and high-performance computing.
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