Versal™ AI Core FPGA System On Chip (SoC) with 1M Logic Cells, Dual ARM® Cortex®-A72 Processors, and 1596-BGA Package
Specifications
Logic Cells:
1M
Peripherals:
DDR, DMA, PCIe
Package Type:
1596-BFBGA
I/O Count:
500
Operating Temperature:
0°C ~ 100°C (TJ)
Core Processor:
Dual ARM® Cortex®-A72 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5F With CoreSight™
Speed:
400MHz, 1GHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture:
MPU, FPGA
Supplier Package:
1596-BGA (37.5x37.5)
Series:
Versal™ AI Core
Product Status:
Active
RAM Size:
N/A
Flash Size:
N/A
Primary Attributes:
Versal™ AI Core FPGA, 1M Logic Cells
Highlight:
1M Logic Cells Versal™ AI Core FPGA
,Dual ARM® Cortex®-A72 System On Chip (SoC)
,1596-BGA Package Integrated Circuit
Introduction
XCVC1702-1LSEVSVA1596
Versal™ AI Core Series FPGA
Experience unparalleled performance and flexibility with the Versal™ AI Core Series, a System on Chip (SOC) designed to accelerate AI and data-intensive workloads. Featuring a powerful combination of ARM® Cortex®-A72 and Cortex™-R5F processors, this FPGA offers a robust platform for advanced applications.
- High-performance AI acceleration with dedicated cores
- Integrated ARM® Cortex®-A72 and Cortex™-R5F processors for versatile control
- 1 Million Logic Cells for complex design implementation
- Flexible connectivity options for seamless integration
- Optimized for demanding applications in AI, data analytics, and high-performance computing
Target Industries & Applications: Data Center Acceleration, Automotive, Aerospace & Defense, Industrial IoT, Medical Imaging
Product Attributes
Brand
AMD
Packaging
Tray
FOB Unit
Piece
Packaging/Delivery
LCL, AIR, FCL, Express
Technical Specifications
| Parameter | Specification | Details |
|---|---|---|
| Category | Integrated Circuits (ICs) | Embedded System On Chip (SoC) |
| Product Status | Active | |
| Peripherals | DDR, DMA, PCIe | |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells | |
| Series | Versal™ AI Core | |
| Supplier Device Package | 1596-BGA (37.5x37.5) | |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Operating Temperature | 0°C ~ 100°C (TJ) | |
| Architecture | MPU, FPGA | |
| Package / Case | 1596-BFBGA | |
| Number Of I/O | 500 | |
| Speed | 400MHz, 1GHz | |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5F With CoreSight™ |
Send RFQ
Stock:
MOQ: