Arria 10 SX FPGA System On Chip (SoC) IC with 270K Logic Elements, Dual ARM Cortex-A9 MPCore, and 1.5GHz Clock Speed
Category:
Integrated Circuits ICs
Specifications
Logic Elements:
270K
Series:
Arria 10 SX
Package Type:
Tray
Device Package:
780-FBGA, FC (29x29)
Connectivity Options:
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
-40°C ~ 100°C (TJ)
Architecture:
MCU, FPGA
Case Package:
780-BBGA, FCBGA
I/O Count:
360
RAM Size:
256KB
Clock Speed:
1.5GHz
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ With CoreSight™
Flash Size:
-
Peripherals:
DMA, POR, WDT
Primary Attributes:
FPGA - 270K Logic Elements
Highlight:
270K Logic Elements Arria 10 SX FPGA
,Dual ARM Cortex-A9 MPCore System On Chip (SoC) IC
,1.5GHz Clock Speed Integrated Circuit
Introduction
Arria 10 SX FPGA - System On Chip (SOC) IC
10AS027E3F29I2SG
Experience unparalleled performance and flexibility with the Arria 10 SX FPGA - System On Chip (SOC) IC. This advanced solution integrates dual ARM® Cortex®-A9 MPCore™ processors with a powerful FPGA fabric, offering a unique combination of processing power and reconfigurable logic for demanding applications.
Key Features
- High-performance Dual ARM® Cortex®-A9 MPCore™ processors
- 270K Logic Elements for extensive customization
- 1.5GHz clock speed for rapid processing
- Integrated System On Chip (SOC) architecture for efficiency
- Wide range of connectivity options for seamless integration
Target Industries & Applications
Aerospace, Defense, Communications, High-Performance Computing, Embedded Vision, Industrial Automation, Medical Devices.
Product Attributes
Brand
Intel
Origin
N/A
Packaging
Tray
Color
N/A
Packaging/Delivery
LCL, AIR, FCL, Express
FOB Price
0
MOQ
N/A
FOB Unit
Piece
Technical Specifications
| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Product Status | Active |
|---|---|---|---|
| Peripherals | DMA, POR, WDT | Primary Attributes | FPGA - 270K Logic Elements |
| Series | Arria 10 SX | Package | Tray |
| Supplier Device Package | 780-FBGA, FC (29x29) | Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) | Architecture | MCU, FPGA |
| Package / Case | 780-BBGA, FCBGA | Number Of I/O | 360 |
| RAM Size | 256KB | Speed | 1.5GHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ With CoreSight™ | Flash Size | - |
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