Stratix 10 SX FPGA System On Chip (SoC) with Quad ARM Cortex-A53 MPCore 1100K Logic Elements and 1.5GHz Clock Speed
Specifications
Logic Elements:
1100K
Series:
Stratix® 10 SX
Package Type:
Tray
Device Package:
1760-FBGA (42.5x42.5)
Connectivity:
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
0°C ~ 100°C (TJ)
Architecture:
MCU, FPGA
Case Package:
1760-BBGA, FCBGA
Peripherals:
DMA, WDT
RAM Size:
256KB
Clock Speed:
1.5GHz
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ With CoreSight™
Flash Size:
Not Applicable
Supplier Package:
1760-FBGA
Package Dimensions:
42.5x42.5 Mm
Highlight:
Quad ARM Cortex-A53 MPCore System On Chip (SoC)
,1100K Logic Elements FPGA
,1.5GHz Clock Speed Integrated Circuit
Introduction
1SX110HN1F43E2VGS1 - Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ System On Chip
This advanced System On Chip (SoC) integrates the power of an FPGA with a high-performance quad-core ARM® Cortex®-A53 MPCore™ processor. Designed for demanding applications, it offers unparalleled flexibility and processing capabilities.
Key Features
- High Performance: 1.5GHz clock speed for rapid processing
- Massive Logic Capacity: 1100K logic elements for complex designs
- Integrated Processing: Powerful quad-core ARM® processor for system control and applications
- Advanced Connectivity: Wide range of interfaces for seamless integration
- Scalable Architecture: Stratix® 10 SX FPGA for future-proof solutions
Target Applications
High-performance computing, networking infrastructure, data center acceleration, advanced driver-assistance systems (ADAS), embedded vision, and complex signal processing.
Product Attributes
Brand: Intel
Origin: N/A
Material: N/A
Color: N/A
FOB Unit: piece
Packaging/Delivery: LCL, AIR, FCL, Express
Technical Specifications
| Parameter | Details | Value | Notes |
|---|---|---|---|
| Category | Integrated Circuits (ICs) | Embedded | System On Chip (SoC) |
| Product Status | Active | - | - |
| Primary Attributes | FPGA | 1100K Logic Elements | - |
| Series | Stratix® 10 SX | - | - |
| Package | Tray | - | - |
| Supplier Device Package | 1760-FBGA | 42.5x42.5 | mm |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||
| Operating Temperature | Junction Temperature (TJ) | 0°C ~ 100°C | - |
| Architecture | MCU | FPGA | - |
| Package / Case | 1760-BBGA, FCBGA | ||
| Peripherals | DMA, WDT | ||
| RAM Size | Internal | 256KB | - |
| Speed | Core Clock | 1.5GHz | - |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ With CoreSight™ | ||
| Flash Size | Internal | - | Not Applicable |
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