XCZU3EG-L1SFVC784I Integrated Circuit SoC with 154K+ Logic Cells, Quad ARM Cortex-A53 for Industrial Temperature Range
Category:
Integrated Circuits ICs
Specifications
Base Product Number:
XCZU3
Peripherals:
DMA, WDT
Logic Cells:
154K+
Series:
Zynq® UltraScale+™ MPSoC EG
Supplier Device Package:
784-FCBGA (23x23)
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
-40°C ~ 100°C (TJ)
Architecture:
MCU, FPGA
Package Case:
784-BFBGA, FCBGA
Number Of I/O:
252
RAM Size:
256KB
Speed:
500MHz, 600MHz, 1.2GHz
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5 With CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Highlight:
154K+ Logic Cells Integrated Circuit
,Quad ARM Cortex-A53 SoC
,Industrial Temperature Range System On Chip
Introduction
XCZU3EG-L1SFVC784I - High-Performance Integrated Circuit
Experience cutting-edge technology with the XCZU3EG-L1SFVC784I, a premium Integrated Circuit (IC) designed for demanding industrial and embedded systems. Manufactured by AMD, this System-on-Chip offers a robust platform for innovation and reliable performance.
Key Benefits
- Integrated System-on-Chip (SoC) with powerful ARM cores and FPGA fabric
- High logic cell density for complex designs
- Extensive peripheral support for diverse connectivity needs
- Robust operating temperature range for industrial environments
- Sufficient inventory and prompt shipping for immediate deployment
Target Industries & Applications
Aerospace, Defense, Industrial Automation, Medical Devices, Communications Infrastructure, High-Performance Computing
Product Attributes
| Brand | AMD |
|---|---|
| Origin | China |
| Packaging | Tray |
| Delivery | LCL, AIR, FCL, Express |
| FOB Price | Contact for Quote |
| MOQ | Available Upon Request |
Technical Specifications
| Category | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) |
|---|---|
| Base Product Number | XCZU3 |
| Product Status | Active |
| Primary Attributes | Zynq® UltraScale+™ FPGA, 154K+ Logic Cells Zynq® UltraScale+™ MPSoC EG 784-FCBGA (23x23) AMD Quad ARM® Cortex®-A53 MPCore™ With CoreSight™ Dual ARM® Cortex™-R5 With CoreSight™ ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 784-BFBGA, FCBGA |
| Number of I/O | 252 |
| RAM Size | 256KB |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ With CoreSight™ Dual ARM® Cortex™-R5 With CoreSight™ ARM Mali™-400 MP2 |
| Flash Size | - |
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