SmartFusion®2 FPGA System On Chip (SoC) with 150K Logic Modules, ARM® Cortex®-M3 Core, and 166MHz Speed
Category:
Integrated Circuits ICs
Specifications
Logic Modules:
150K
Operating Temperature:
-40°C ~ 100°C (TJ)
Package Case:
484-BFBGA
Number Of I/O:
273
RAM Size:
64KB
Speed:
166MHz
Core Processor:
ARM® Cortex®-M3
Flash Size:
512KB
Peripherals:
DDR, PCIe, SERDES
Connectivity:
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture:
MCU, FPGA
Supplier Device Package:
484-FBGA (19x19)
Series:
SmartFusion®2
Base Product Number:
M2S150
Product Status:
Active
Highlight:
150K Logic Modules SmartFusion®2 FPGA
,ARM® Cortex®-M3 Core System On Chip (SoC)
,166MHz Speed Integrated Circuit (IC)
Introduction
M2S150TS-FCV484I
Product Overview
Experience unparalleled integration and performance with the ARM® Cortex®-M3 System On Chip (SOC) IC, featuring the SmartFusion®2 FPGA. This advanced solution offers 150K logic modules and operates at a swift 166MHz, housed in a compact 484-FBGA (19x19) package. Designed for demanding applications, it provides a powerful platform for complex embedded systems.
Key Features
- High-performance ARM® Cortex®-M3 core for efficient processing
- 150K logic modules for extensive customization and flexibility
- Integrated FPGA fabric for hardware acceleration and specialized functions
- Robust connectivity options for seamless system integration
- Reliable operation in a wide temperature range
Target Industries & Applications
- Industrial Automation
- Aerospace & Defense
- Automotive Electronics
- Medical Devices
- Telecommunications
- Consumer Electronics
Product Attributes
Packaging & Delivery
LCL, AIR, FCL, Express
Product MOQ
N/A
FOB Price
$0.00
FOB Unit
piece
Technical Specifications
| Category | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) |
|---|---|
| Base Product Number | M2S150 |
| Product Status | Active |
| Peripherals | DDR, PCIe, SERDES |
| Primary Attributes | FPGA - 150K Logic Modules |
|---|---|
| Series | SmartFusion®2 |
| Package | Tray |
| Manufacturer | Microchip Technology |
| Supplier Device Package | 484-FBGA (19x19) |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 484-BFBGA |
| Number Of I/O | 273 |
| RAM Size | 64KB |
| Speed | 166MHz |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB |
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