Microchip Technology M2S090TS SmartFusion®2 SoC with ARM® Cortex®-M3 and 90K Logic Modules in 676-FBGA Package
Category:
Integrated Circuits ICs
Specifications
Logic Modules:
90K
Package:
676-BGA
Supplier Package:
676-FBGA (27x27)
Operating Temperature:
0°C ~ 85°C (TJ)
Number Of I/O:
425
RAM Size:
64KB
Speed:
166MHz
Core Processor:
ARM® Cortex®-M3
Flash Size:
512KB
Peripherals:
DDR, PCIe, SERDES
Connectivity:
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture:
MCU, FPGA
Series:
SmartFusion®2
Base Product Number:
M2S090
Product Status:
Active
Highlight:
ARM® Cortex®-M3 System On Chip (SoC)
,90K Logic Modules FPGA SoC
,676-FBGA SmartFusion®2 SoC
Introduction
M2S090TS-FGG676 FPGA SoC
Experience the power and flexibility of the Microchip Technology M2S090TS, an advanced System on Chip (SoC) integrating an ARM® Cortex®-M3 processor with a powerful FPGA fabric. This device is designed for high-performance embedded applications requiring significant processing power, custom logic, and extensive connectivity.
Key Benefits
- High-performance ARM® Cortex®-M3 core at 166MHz for demanding tasks
- 90K Logic Modules FPGA fabric for custom hardware acceleration and flexibility
- Rich peripheral set including DDR, PCIe, and SERDES for advanced system integration
- Extensive connectivity options for seamless communication with other systems
- Compact 676-FBGA package suitable for space-constrained designs
Ideal Applications
Industrial Automation, Communications, Aerospace & Defense, High-Performance Computing, and Embedded Systems requiring custom logic and processing.
Product Attributes
Brand: Microchip Technology
Packaging: Tray
Delivery Methods: LCL, AIR, FCL, Express
Technical Specifications
| Category | IC Embedded System On Chip (SoC) |
|---|---|
| Base Product Number | M2S090 |
| Product Status | Active |
| Primary Attributes | FPGA - 90K Logic Modules |
| Series | SmartFusion®2 |
| Manufacturer | Microchip Technology |
| Supplier Device Package | 676-FBGA (27x27) |
| Package / Case | 676-BGA |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Architecture | MCU, FPGA |
| Number of I/O | 425 |
| RAM Size | 64KB |
| Speed | 166MHz |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB |
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