Zynq UltraScale+ MPSoC EG System On Chip (SoC) with Quad ARM Cortex-A53 MPCore 103K+ Logic Cells in 625-FCBGA Package
Category:
Integrated Circuits ICs
Specifications
Base Product Number:
XCZU2
Peripherals:
DMA, WDT
Primary Attributes:
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Series:
Zynq® UltraScale+™ MPSoC EG
Supplier Device Package:
625-FCBGA (21x21)
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
0°C ~ 100°C (TJ)
Architecture:
MCU, FPGA
Package Case:
625-BFBGA, FCBGA
Number Of I/O:
180
RAM Size:
256KB
Speed:
500MHz, 600MHz, 1.2GHz
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5 With CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
Logic Cells:
103K+
Highlight:
Quad ARM Cortex-A53 MPCore System On Chip (SoC)
,103K+ Logic Cells FPGA
,625-FCBGA Package Zynq UltraScale+ MPSoC EG
Introduction
XCZU2EG-1SFVA625E
Product Overview
This advanced System On Chip (SOC) integrates powerful processing capabilities with flexible FPGA logic, offering a comprehensive solution for complex embedded systems. Featuring Quad ARM® Cortex®-A53 MPCore™ and Dual ARM®Cortex™-R5 cores, alongside an ARM Mali™-400 MP2, it delivers exceptional performance for demanding applications.
- High-performance processing with heterogeneous cores
- Flexible FPGA fabric for custom acceleration
- Rich connectivity options for seamless integration
- Optimized for power efficiency and scalability
Target Applications
Product Attributes
Brand: AMD
Package: Tray
FOB Unit: piece
Packaging/Delivery: LCL, AIR, FCL, Express
Technical Specifications
| Category | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) |
|---|---|
| Base Product Number | XCZU2 |
| Product Status | Active |
| Peripherals | DMA, WDT |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Supplier Device Package | 625-FCBGA (21x21) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 625-BFBGA, FCBGA |
| Number Of I/O | 180 |
| RAM Size | 256KB |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5 With CoreSight™, ARM Mali™-400 MP2 |
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