XC7S25-1CSGA324I FPGA with 150 I/O, 1620Kbit Block RAM, and Industrial Wide Temperature Operation for Embedded Applications
Specifications
Manufacturer:
AMD
Product Number:
XC7S25-1CSGA324I
Description:
IC FPGA 150 I/O 324CSGA
Introduction
XC7S25-1CSGA324I
This FPGA features rich logic, memory, DSP and clock resources, widely used in industrial control, signal processing, communication and embedded edge applications.
Core Functions
High-Density Programmable Logic
Adopts 6-input LUT configurable logic architecture, supports custom combinational logic, sequential logic and finite state machine development, suitable for complex digital logic integration.
On-Chip Memory Resources
Equipped with 1620Kbit block RAM (36KB dual-port RAM with built-in FIFO logic), supports high-speed on-chip data buffering, caching and queue management.
Precision Clock Management
Integrated CMT clock management tiles with PLL & MMCM, realize low-jitter, high-precision clock frequency multiplication, frequency division and phase adjustment, maximum operating frequency up to 464MHz.
DSP Arithmetic Acceleration
Built-in DSP slices, support high-speed multiplication, addition and multiply-accumulate operations, accelerate digital signal processing algorithms.
Embedded Processing Capability
Supports MicroBlaze soft core processor embedding, realize hardware-software collaborative embedded control system.
High-Speed Connectivity & Interface
Supports PCIe Gen3, Ethernet, LVDS, SPI, UART, GPIO and other multi-standard high-speed communication interfaces.
Security & Reliability
Built-in 256-bit AES encryption, HMAC/SHA-256 authentication, SEU error detection and correction circuits, meet industrial high-reliability requirements.
Industrial Wide Temperature Operation
Stable operation under -40℃~+125℃ harsh environment, anti-interference and high stability.
Main Application Fields
- Industrial Control & Automation: Real-time motion control, motor FOC control, PLC logic control, industrial bus communication (EtherCAT/PROFINET), sensor data acquisition and signal conditioning.
- Digital Signal Processing: Audio/video signal processing, image filtering, edge detection, real-time data decoding and algorithm acceleration.
- Communication Equipment: Protocol conversion, data routing, high-speed serial communication interface expansion, wireless communication baseband processing.
- Embedded Edge Computing: IoT edge node data preprocessing, peripheral interface expansion, embedded controller development.
- Instrumentation & Measurement: High-speed data acquisition, precision signal measurement, arbitrary waveform generation and real-time data analysis.
- Automotive Electronics & Harsh Environment Devices: Industrial wide temperature design adapts automotive, aerospace and other high-reliability harsh application scenarios.
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