Home > Products > Integrated Circuits ICs > T13F256C3 is an Efinix 40nm low-power Trion FPGA with 12828 LEs, integrated MIPI CSI-2 hard cores, mainly used for automotive vision, machine vision and IoT edge acceleration

T13F256C3 is an Efinix 40nm low-power Trion FPGA with 12828 LEs, integrated MIPI CSI-2 hard cores, mainly used for automotive vision, machine vision and IoT edge acceleration

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Integrated Circuits ICs
trion13-ds-v3.2.pdf
Specifications
Manufacturer:
Efinix, Inc.
Product Number:
T13F256C3
Description:
IC FPGA TRION T13 195 IO 256FBGA
Introduction
T13F256C3 Efinix Trion FPGA
T13F256C3 is an Efinix 40nm low-power Trion FPGA with 12,828 LEs, integrated MIPI CSI-2 hard cores, mainly used for automotive vision, machine vision and IoT edge acceleration.
Product Overview
T13F256C3 is a low-power, high-performance Field Programmable Gate Array (FPGA) from Efinix Trion® T13 series, manufactured with advanced 40nm Quantum™ architecture, packaged in 256-pin BGA.
Core Features
  • Integrates 12,828 logic elements (LEs), rich embedded block RAM resources, and dedicated DSP multiplier-accumulator units for parallel signal processing.
  • Built-in hardened dual-channel MIPI D-PHY/CSI-2 TX/RX hard cores, each lane supports up to 1.5Gbps; integrated high-speed LVDS interfaces (800Mbps per lane), PLL clock management module.
  • Abundant configurable GPIO, supports multi-voltage I/O banks (1.8V/2.5V/3.3V), SPI/I²C peripheral communication interfaces.
  • Adopts ultra-low-power Quantum architecture, core voltage 1.1V, much lower power consumption than traditional FPGAs; supports in-system programmable and reconfigurable logic.
  • Industrial & automotive grade wide temperature range: -40℃~105℃, high reliability and stability.
Typical Applications
  • Automotive electronics: intelligent cockpit, ADAS vision processing, camera interface bridge, automotive control modules.
  • Machine vision & image processing: industrial cameras, security IP cameras, real-time video acquisition, image preprocessing and encoding.
  • IoT edge computing nodes, sensor hub data fusion and real-time edge acceleration.
  • High-speed interface conversion, LVDS/MIPI signal bridging, peripheral logic expansion and custom control logic.
  • Portable smart devices, industrial control small modules, edge AI inference hardware acceleration.
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