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ICS542MIT 156 MHz Clock Fanout Buffer and Divider IC with 1:2 Ratio and 3V to 5.5V Operating Range

Category:
Integrated Circuits ICs
Specifications
Ratio - Input:Output:
1:2
Type:
Fanout Buffer (Distribution), Divider
Mounting Type:
Surface Mount
Package:
Tape & Reel (TR)
Differential - Input:Output:
No/No
Input:
CMOS
Supplier Device Package:
8-SOIC
Frequency - Max:
156 MHz
Voltage - Supply:
3V ~ 5.5V
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Output:
3-State, CMOS
Operating Temperature:
-40°C ~ 85°C
Number Of Circuits:
1
Base Product Number:
ICS542
Max Frequency:
156 MHz
Highlight:

156 MHz Clock Fanout Buffer

,

1:2 Ratio Clock Divider IC

,

3V to 5.5V Integrated Circuit

Introduction
ICS542MIT Clock Fanout Buffer and Divider IC
Product Overview
The ICS542MIT is a high-performance Clock Fanout Buffer and Divider IC designed for efficient clock distribution in demanding applications. With its 1:2 ratio, it effectively splits a single clock input into two synchronized outputs, ensuring precise timing across your system. Its robust design and broad operating voltage range make it a versatile solution for various electronic designs.
Key Features and Benefits
• High Frequency Operation: Supports up to 156 MHz, ideal for high-speed digital systems
• Precise Clock Distribution: Ensures synchronized clock signals for improved system stability
• Low Power Consumption: Operates efficiently within a 3V to 5.5V range
• Compact Package: 8-SOIC package for space-constrained designs
• Wide Operating Temperature: Functions reliably from -40°C to 85°C
Technical Specifications
Product Type Clock Fanout Buffer and Divider IC
Configuration 1:2 Ratio
Maximum Frequency 156 MHz
Package 8-SOIC
Operating Voltage 3V to 5.5V
Temperature Range -40°C to 85°C
Target Applications
Industries Served: Telecommunications, Computing, Industrial Automation, Consumer Electronics

This IC is crucial for applications where precise clock management is paramount. It is particularly useful in systems requiring clock signal splitting for multiple components or subsystems, including data communication equipment, computing systems, industrial control systems, and high-performance consumer electronics.
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