OMAP-L138 SoC Dual-Core Processor with 456 MHz Performance, Low-Power Design, and Extended Temperature Range
Category:
Texas Instruments ICs
Specifications
MFR:
TI
Part Number:
OMAP-L138EZWTD4
Breakdown:
IC MPU OMAP-L1X 456MHZ 361NFBGA
Highlight:
456 MHz OMAP-L138 SoC
,Low-Power Dual-Core Processor
,Extended Temperature Range Applications Processor
Introduction
OMAP-L138EZWTD4 Technical Overview
Product Identification
- Manufacturer: TI
- Full Designation: OMAP-L138 Low-Power Applications Processor
- Part Number: OMAP-L138EZWTD4
- Core Innovation: Asymmetric Dual-Core SoC combining ARM9 + DSP for optimal performance/power
Architecture Overview
OMAP-L138 SYSTEM BLOCK DIAGRAM: ┌─────────────────────────────────────────────────────┐ │ OMAP-L138 SoC │ ├──────────────┬──────────────────────────────────────┤ │ ARM926EJ-S │ TMS320C674x DSP Core │ │ Core │ (Floating/Fixed-Point) │ │ @456MHz │ @456MHz │ │ (32-bit RISC)│ │ ├──────────────┼──────────────────────────────────────┤ │ Shared Memory: 128KB RAM, Shared Peripherals │ ├─────────────────────────────────────────────────────┤ │ SYSTEM INTERCONNECT & POWER MANAGEMENT │ ├─────────────────────────────────────────────────────┤ │ PERIPHERALS & INTERFACES (See Section 4) │ └─────────────────────────────────────────────────────┘
Key Architectural Features
- Heterogeneous Dual-Core: ARM926EJ-S for control/application processing and C674x DSP for signal/math-intensive processing
- Shared Memory Architecture: Enables zero-copy data transfer
- Smart Reflex Technology: Adaptive voltage/frequency scaling
Core Processor Specifications
ARM926EJ-S Core (456 MHz)
- 32-bit RISC processor with MMU
- 16KB Instruction Cache, 16KB Data Cache
- 8KB RAM, 8KB ROM
- Jazelle technology for Java acceleration
- ARMv5TE instruction set architecture
TMS320C674x DSP Core (456 MHz)
- Industry's lowest-power floating-point DSP
- VLIW architecture (8 functional units)
- Native hardware support for IEEE single/double precision
- Advanced C compiler with intrinsic optimizations
- 32KB L1P, 32KB L1D, 256KB L2 memory
Peripheral Integration
Communication Interfaces
- Ethernet MAC (10/100): With MII/RMII and MDIO
- USB 2.0: 1x USB 2.0 OTG (12-pin ULPI interface), 1x USB 1.1 OHCI Host
- Serial Ports: 2x UART, 2x McASP, 1x McBSP, 2x SPI, 1x I²C
- CAN 2.0: 2x CAN controllers
Data Conversion & Timing
- 10-bit ADC: 8 channels, 3.5 MSPS
- PWM/HRPWM: 3x 16-bit enhanced eCAP/PWM
- Timers: 7x 32-bit general-purpose timers
- Watchdog Timer
Key Technical Specifications
| Parameter | Specification |
|---|---|
| Process Technology | 65nm CMOS |
| Core Voltages | CVDD: 1.2V, DVDD: 1.8V/3.3V |
| Power Consumption | <300mW @ 300MHz (typical) <500mW @ 456MHz (max) |
| Package | 361-ball PBGA (16mm x 16mm, 0.65mm pitch) |
| Temperature Range | Extended Industrial: -40°C to 105°C |
| Pin Count | 361 (EZWT package variant) |
Primary Application Domains
Industrial Automation & Control: PLC/PAC systems, motor drives, process control instrumentation, industrial robots
Medical & Healthcare: Patient monitoring, portable ultrasound, infusion pumps, diagnostic equipment
Audio/Video Processing: Audio processors, video analytics, teleconferencing systems
Communications Infrastructure: Radio access networks, gateways/routers, VoIP systems
Test & Measurement: Oscilloscopes/data loggers, spectrum analyzers, automated test equipment
Development Ecosystem
Software Support
- Operating Systems: Linux (TI Processor SDK), TI-RTOS, FreeRTOS, WinCE
- Development Tools: Code Composer Studio (CCS) IDE, ARM GCC toolchain, DSP/BIOS
- Middleware: Codec engines, industrial protocol stacks, graphics libraries
Design Considerations
Power Management Strategy
- Multiple Power Domains requiring careful sequencing
- Power Estimation Tool: TI's Power Estimation Spreadsheet
- Thermal: θJA = 28.4°C/W (with airflow)
Current Status: Active production for industrial customers. Mature product with long-term supply guaranteed. Consider AM6x or AM62x for new designs requiring similar capabilities.
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