OMAPL138EZWTD4 Low-Power Dual-Core SoC by TI with 456 MHz for Industrial-Grade Applications
Specifications
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TI
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OMAPL138EZWTD4
Highlight:
Low-Power OMAPL138EZWTD4 SoC
,Industrial-Grade Dual-Core SoC
,456 MHz Texas Instruments SoC
Introduction
OMAPL138EZWTD4 Low-Power Dual-Core SoC
OMAPL138EZWTD4 is a low-power, dual-core System on Chip from TI, integrating an ARM926EJ‑S MPU and a C674x floating-point DSP. This SoC is optimized for industrial, embedded, and real‑time processing scenarios with high integration, low power consumption, and robust connectivity.
Core Architecture
Dual-Core Processing Architecture
- ARM926EJ‑S (456 MHz max): 32‑bit RISC core with 16‑KB I‑Cache/16‑KB D‑Cache, MMU, Jazelle for Java acceleration, Thumb instruction set, and real‑time debugging via Embedded ICE‑RT; ideal for OS, UI, and control tasks.
- C674x DSP (456 MHz max): Floating‑point VLIW core with 32‑KB L1 PGM/RAM, 256‑KB L2 RAM, delivering up to 3648 MIPS and 2746 MFLOPS; excels at real‑time signal processing, math‑intensive computation, and floating‑point operations.
- CoreLink: Efficient inter‑core communication via Shared Memory, Mailbox, and HPI for seamless task partitioning between ARM (system management) and DSP (signal processing).
Key Peripherals & Interfaces
| Subsystem | Interfaces | Use Cases |
|---|---|---|
| Connectivity | 10/100 Ethernet, USB 2.0 OTG/Host, UART, SPI, I2C, CAN | Industrial comms, device networking, HMI |
| Storage | SATA 3 Gbps, SD/MMC | Local data logging, mass storage |
| I/O | VPIF (video capture/display), uPP (12‑bit parallel I/O), GPIO | Machine vision, high‑speed data acquisition |
| Timing & Control | RTC, 4× GP Timers, PWM | Precision timing, motor control |
| Debug & Power | JTAG, Power/Sleep Controller | Low‑power design, real‑time debugging |
Performance & Power Efficiency
- Maximum frequency: 456 MHz (ARM9 + DSP); also available at 375 MHz for lower power consumption
- Ultra‑low power for floating‑point DSP + ARM9 in industrial temperature range (−40°C to 105°C)
- Power management: Dynamic voltage/frequency scaling (DVFS), sleep modes, and 32‑kHz RTC for long battery life in portable industrial devices
Typical Applications
Industrial Automation
- Programmable Logic Controllers (PLCs): ARM for system management, DSP for real‑time control loops and sensor data processing
- Motor Control: DSP handles field‑oriented control (FOC) algorithms; ARM manages HMI and network communication
- Machine Vision: VPIF + DSP for image processing (inspection, defect detection); ARM runs Linux/QNX and HMI
Test & Measurement Equipment
- Digital Oscilloscopes/Spectrum Analyzers: DSP for signal acquisition, FFT, and filtering; ARM for UI, data storage (SATA/SD), and remote control via Ethernet
- Precision Instruments: High‑res ADC/DAC interfacing, real‑time calibration, and floating‑point computation for accuracy
Energy & Utilities
- Smart Grid: ARM for protocol stack (IEC 61850) and data logging; DSP for power quality analysis (harmonic detection, reactive power calculation)
- Solar/Wind Inverters: DSP for MPPT and grid‑tie control; ARM for monitoring, communication, and safety interlocks
Audio/Video & Communications
- VoIP Gateways/Conference Phones: DSP for echo cancellation, noise reduction, and codec processing (G.711, G.729); ARM for call control and network stack
- Video Surveillance: VPIF captures video; DSP does real‑time encoding (H.264); ARM manages storage and network streaming
Medical Devices
- Portable Ultrasound: DSP for beamforming and image reconstruction; ARM runs UI and data management
- Patient Monitors: DSP processes ECG/EEG signals; ARM handles alerts, data logging, and hospital network integration
Embedded Computing
- Edge AI/ML: ARM runs lightweight Linux + ML frameworks; DSP accelerates inference for sensor fusion and anomaly detection
- Software‑Defined Radio (SDR): DSP for baseband processing; ARM manages radio control and data routing
Key Advantages
- Dual-Core Flexibility: Partition workloads between ARM (OS, management) and DSP (real‑time processing) to optimize performance and power
- Rich Ecosystem: Supports Linux, Windows CE, and bare‑metal; TI provides EVMs, dual‑core communication libraries, and reference designs (e.g., TIDEP0038 for vision analytics)
- Industrial Reliability: Extended temperature range, RoHS compliance, and high integration reduce BOM cost and improve field durability
Ordering Information
Part Number: OMAPL138EZWTD4
Package: 361‑pin NFBGA (RoHS compliant)
Temperature Grade: Extended (−40°C to 105°C)
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